AM resin possesses the following characteristics and applications:
Flexible acylation modification: It allows for rapid acylation with carboxylic acid-containing linkers through standard amide bond formation methods (such as DIC/HOBt or EDC/HCl coupling reagents), providing a highly functionalizable support for solid-phase organic synthesis (SPOS).
Biphasic application compatibility: Solid-phase synthesis: As a universal carrier, it is suitable for constructing molecular libraries containing amide bonds. Liquid-phase synthesis scavenger: By selectively capturing excess electrophilic reagents (such as acid chlorides, activated esters), it purifies the reaction system without interfering with non-electrophilic reagents (such as amines, alcohols), significantly simplifying the post-processing procedure
产品编号 Product No. | 交联度(%) %DVB | 粒径(目) ParticleSize (mesh) | 基团负载量(mmol/g) | 膨胀体积SwellingVolume(in DCM,ml/g) |
| HXDD008-0103 | 1% | 100-200 | 0.4-0.6 0.6-0.8 0.8-1.0 1.0-1.2 1.2-1.4 1.4-1.6 1.6-2.0 2.0-2.4 | 8-10 |
| HXDD008-0203 | 2% | 100-200 | 6-8 | |
| HXDD008-0104 | 1% | 200-400 | 8-10 | |
| HXDD008-0204 | 2% | 200-400 | 6-8 | |